Display devivce

ABSTRACT

A display device includes: a light-emitting substrate including a base substrate having a non-display area and a display area that surrounds the non-display area; an input sensing unit disposed on the light-emitting substrate; and a hole penetrating front and rear surfaces of each of the light-emitting substrate and the input sensing unit, wherein the light-emitting substrate includes a plurality of recesses, the non-display area includes a hole area which overlaps with the hole, a recess area in which the plurality of recesses are disposed and surrounds the hole area, and a peripheral area which surrounds the recess area, and the input sensing unit includes a plurality of first sensor members overlapping the display area and a first connector connecting the first sensor members and overlapping the groove area.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of U.S. patent application Ser. No.16/596,050, filed on Oct. 8, 2019, and claims priority from and thebenefit of Korean Patent Application No. 10-2018-0148162, filed on Nov.27, 2018, which is hereby incorporated by reference for all purposes asif fully set forth herein.

BACKGROUND Field

Exemplary implementations of the invention relate generally to a displaydevice and, more particularly, to a display device having a touch screendisplay and one or more holes in the display to accommodate featureslike cameras.

Discussion of the Background

Display devices have become increasingly important with the developmentof multimedia. Accordingly, various display devices such as an organiclight-emitting diode (OLED) display device, a liquid crystal displaydevice (LCD), and the like have been developed and used.

Meanwhile, a touch sensing unit, which is a type of information inputdevice, may be provided and used in a display device. For example, atouch sensor may be attached to one surface of a display panel or may beformed in one integral body with the display panel. Then, a user canenter information by pressing or touching the touch sensing unit whileviewing images displayed on the screen of the display device.

The display device may include a hole in its display area, and thesensors of a camera or the like may be disposed in the hole.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Display devices constructed according to exemplary implementations ofthe invention have improved touch recognition in areas near a hole inthe display to accommodate a feature like a camera. According to theprinciples and exemplary embodiments of the invention, signalinterference between the electrical components in the display can bereduced, as can dead spaces. For example, in exemplary embodiments ofthe invention the signal interference between signal lines connected topixels and connecting wires connected to touch electrodes can bereduced, and as a result, touch performance can be improved. Also, deadspace in the display device between a hole and a display area can bereduced, which increases touch sensitivity.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

According to an embodiment of the invention, a display device includes:a light-emitting substrate including a base substrate having anon-display area and a display area that surrounds the non-display areaare defined; an input sensing unit disposed on the light-emittingsubstrate; and a hole penetrating front and rear surfaces of thelight-emitting substrate and front and rear surfaces of the inputsensing unit, wherein the light-emitting substrate includes a pluralityof recesses, the non-display area includes a hole area which overlapswith the hole, a recess area in which the plurality of recesses aredisposed and surrounds the hole area, and a peripheral area whichsurrounds the recess area, and the input sensing unit includes aplurality of first sensor members overlapping the display area and afirst connector connecting the plurality of first sensor membersoverlapping with the recess area.

The recesses may include grooves from which parts of the base substrateare removed, and the recess area may include a groove area.

The light-emitting substrate may further include a circuit layer whichis disposed on the base substrate, a light-emitting element layer whichis disposed on the circuit layer, a thin-film encapsulation layer whichis disposed on the light-emitting element layer, and a first cappinglayer which is disposed on the thin-film encapsulation layer andincludes an inorganic material, and the input sensing unit is disposedon the first capping layer.

The peripheral area may not include the plurality of grooves and may bedisposed between the groove area and the display area, and a sum ofthicknesses of the base substrate, the circuit layer, the light-emittingelement layer, and the thin-film encapsulation layer is substantiallythe same in both the peripheral area and the display area.

The thin-film encapsulation layer may include a first inorganic film, anorganic film, and a second inorganic film, and the light-emittingsubstrate may further include a hole overcoat layer which is disposedbetween the second inorganic film and the first capping layer.

The hole overcoat layer may overlap with the groove area.

The first capping layer may be disposed on substantially an entiresurface of the base substrate, and the input sensing unit may bedisposed on the first capping layer.

Two of the plurality of first sensor members may be disposed adjacent toeach other in a first direction with the hole interposed therebetween.

The input sensing unit may further include second sensor members, two ofwhich are disposed adjacent to each other in a second direction thatintersects the first direction with the hole interposed therebetween anda second connector connecting the two second sensor members, and thesecond connector is disposed to overlap with the groove area.

The first connector may include a first connecting wire and the secondconnector may include a second connecting wire insulated from the firstconnecting wire.

The input sensing unit may include a first touch conductive layer, asecond touch conductive layer, and a touch insulating layer disposedbetween the first and second touch conductive layers, and the firstsensor members, the second sensor members, the first connecting wire,and the second connecting wire may be disposed in the first touchconductive layer.

The input sensing unit may further include a first bridge connectorwhich is disposed in the second touch conductive layer, and the firstconnecting wire may be connected to the first bridge connector.

The first bridge connector and the second connecting wire intersect andmay be insulated from each other.

The input sensing unit may further include two first electrode patternswhich are disposed in each of the two of the plurality of first sensormembers and a third connector which connects the two first electrodepatterns, the two first electrode patterns are insulated from each ofthe two first sensor members, and the third connector is disposed tooverlap with the groove area.

The input sensing unit may further include two second electrode patternsdisposed in each of the two second sensor members, and the two secondelectrode patterns may be insulated from each of the two second sensormembers.

The two second electrode patterns may be dummy patterns.

The first sensor members may include sensing electrodes, and the secondsensor members may include driving electrodes.

The input sensing unit may further include two second sensor membersdisposed adjacent to each other in a second direction that intersectsthe first direction and a second connector which connects the two secondsensor members, and the second connector is disposed to overlap with theperipheral area.

According to another embodiment of the invention, a display deviceincludes: a light-emitting substrate including a hole penetrating frontand rear surfaces of the light-emitting substrate; and an input sensingunit disposed on the light-emitting substrate and including firstdetection electrodes extending in a first direction, wherein thelight-emitting substrate includes a base substrate having a display areaand a hole area, a recess area, and a peripheral area that aresurrounded by the display area, a plurality of pixels disposed on thebase substrate, and signal lines connected to the pixels, the basesubstrate includes a plurality of recesses in the recess area, the holearea overlaps with the hole, the recess area overlaps with the pluralityof recesses, the peripheral area is disposed between the recess area andthe display area, the first detection electrodes include two firstsensor members disposed adjacent to each other with the hole interposedtherebetween in a plan view and a first connector connecting the firsttwo sensor members, the signal lines overlap with the peripheral area,but not with the recess area, and the first connector overlaps with thegroove area.

The recess area may include a groove area, the recesses may includegrooves from which parts of the base substrate are removed, and thefirst connector may include a connecting wire.

The pixels may include light-emitting elements, the light-emittingelements may be disposed in the display area, but may not be in theperipheral area and the recess area.

The input sensing unit may further include second detection electrodesextending in a second direction that intersects the first direction, thesecond detection electrodes may include a plurality of second sensormembers disposed adjacent to one another in the second direction, andthe second detection electrodes may be insulated from the firstdetection electrodes.

The input sensing unit may include a first touch conductive layer, asecond touch conductive layer, and a touch insulating layer disposedbetween the first and second touch conductive layers, the first sensormembers may be disposed in the first touch conductive layer, and thesecond sensor members may be disposed in the second touch conductivelayer.

The second sensor members may include two second sensor members disposedadjacent to each other with the hole area interposed therebetween, andthe input sensing unit may further include a second connector connectingthe two second sensor members.

The second connector may be disposed in the groove area.

The second connector may bypasses the hole area from an outside of thefirst connector and may be disposed in the peripheral area, but not inthe groove area.

According to another exemplary embodiment, a display device including adisplay area and a non-display area having a hole area disposed adjacentto the display area, the display device includes: a light-emittingdisplay unit including signal lines; and a touch sensing unit disposedon the light-emitting display unit and including touch sensing wires,wherein the hole area includes a through hole penetrating both thelight-emitting display unit and the touch sensing unit in a thicknessdirection and a recess area disposed near the through hole, a portion ofthe signal lines are disposed in the non-display area, the touch sensingwires are disposed in the display area and in the recess area, and thetouch sensing wires in the recess area do not overlap with the signallines.

According to still another exemplary embodiment, a display deviceincludes: a light-emitting unit including a base substrate having anon-display area and a display area that surrounds the non-display area;a sensing unit disposed on the light-emitting unit; and a holepenetrating front and rear surfaces of the light-emitting unit and frontand rear surfaces of the sensing unit, wherein the base substrateincludes at least one recess, the non-display area includes a first areawhich overlaps with the hole, a second area in which the at least onerecess is disposed and surrounds the first area, and a third area whichsurrounds the second area, and the sensing unit includes a plurality offirst electrodes overlapping the display area and a first connectorconnecting the plurality of first electrodes and overlapping the secondarea.

Other features and embodiments may be apparent from the followingdetailed description, the drawings, and the claims.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1 is a perspective view of an organic light-emitting diode (OLED)display device constructed according to an embodiment of the invention;

FIG. 2 is a cross-sectional view of the OLED display device according tothe embodiment of FIG. 1;

FIG. 3 is a plan view illustrating the layout of a light-emittingsubstrate included in the OLED display device according to theembodiment of FIG. 1;

FIG. 4 is a circuit diagram illustrating a representative pixel includedin the light-emitting substrate of FIG. 3;

FIG. 5 is a plan view illustrating the layout of an input sensing unitincluded in the OLED display device according to the embodiment of FIG.1;

FIG. 6 is an enlarged plan view illustrating an area FF1 of FIG. 5;

FIG. 7 is a cross-sectional view taken along line I1-I1′ of FIG. 6;

FIG. 8 is a cross-sectional view taken along line I2-I2′ of FIG. 6;

FIG. 9 is an enlarged plan view illustrating an area FF2 of FIG. 5;

FIG. 10 is a cross-sectional view taken along line I3-I3′ of FIG. 9;

FIG. 11 is an enlarged plan view illustrating a part of an input sensingunit of an OLED display device constructed according to anotherembodiment of the invention;

FIG. 12 is a cross-sectional view taken along line II1-II1′ of FIG. 11;

FIGS. 13 through 15 are enlarged plan views illustrating parts of inputsensing units of OLED display devices constructed according to otherembodiments of the invention;

FIG. 16 is an enlarged plan view illustrating a part of an input sensingunit of an OLED display device constructed according to anotherembodiment of the invention;

FIG. 17 is a cross-sectional view taken along line III1-III1′ of FIG.16;

FIG. 18 is a cross-sectional view taken along line III2-III2′ of FIG.16;

FIG. 19 is an enlarged plan view illustrating a part of an input sensingunit of an OLED display device constructed according to anotherembodiment of the invention;

FIG. 20 is a cross-sectional view taken along line IV1-IV1′ of FIG. 19;

FIG. 21 is a cross-sectional view taken along line IV2-IV2′ of FIG. 19;

FIG. 22 is an enlarged plan view illustrating a part of an input sensingunit of an OLED display device constructed according to anotherembodiment of the invention;

FIG. 23 is a cross-sectional view taken along line V1-V1′ of FIG. 22;

FIG. 24 is an enlarged plan view illustrating a part of an input sensingunit of an OLED display device constructed according to anotherembodiment of the invention;

FIG. 25 is a cross-sectional view, taken along line V1-V1′ of FIG. 22,of the input sensing unit of FIG. 24;

FIG. 26 is a plan view illustrating the layout of an input sensing unitincluded in an OLED display device constructed according to anotherembodiment of the invention;

FIG. 27 is an enlarged plan view illustrating an area FF3 of FIG. 26;

FIG. 28 is a cross-sectional view taken along line VII1-VII1′ of FIG.27;

FIG. 29 is a cross-sectional view taken along line VII2-VII2′ of FIG.27;

FIG. 30 is a cross-sectional view taken along line VII3-VII3′ of FIG.27;

FIGS. 31 through 33 are cross-sectional views of an OLED display deviceconstructed according to another embodiment of the invention;

FIGS. 34 and 35 are enlarged plan views illustrating parts of inputsensing units of OLED display devices constructed according to otherembodiments of the invention;

FIG. 36 is a cross-sectional view of an OLED display device according toanother embodiment of the invention; and

FIG. 37 is an enlarged plan view illustrating the layout of an inputsensing unit of an OLED display device constructed according to anotherembodiment of the invention.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonaltiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z-axes, and may be interpretedin a broader sense. For example, the D1-axis, the D2-axis, and theD3-axis may be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

Display devices according to various embodiments of the invention aredevices for displaying moving images or still images, or stereoscopicimages, and can be used not only in mobile electronic devices such asmobile communication terminals, smartphones, tablet PCs, smartwatches,and navigation devices, but also in various other products such astelevisions (TVs), notebook computers, monitors, billboards, or Internetof Things (IoT) devices.

Embodiments of the invention will hereinafter be described withreference to the accompanying drawings. In the description that follows,an organic light-emitting diode (OLED) display device will be describedas an exemplary display device, but the inventive concepts are notlimited thereto. That is, the inventive concepts are also applicable toother display devices such as a liquid crystal display (LCD) device, afield emission display (FED) device, an electrophoretic display (EPD)device, a quantum dot light-emitting diode (QLED) display device, or amicro light-emitting diode (mLED) display device. In the drawings, like(or similar) reference numerals indicate like elements.

FIG. 1 is a perspective view of an OLED display device according to anembodiment of the invention. FIG. 2 is a cross-sectional view of theOLED display device according to the embodiment of FIG. 1.

Referring to FIGS. 1 and 2, an OLED display device 1 may include adisplay area DA and a non-display area NDA.

The display area DA is defined as an area in which an image isdisplayed. The OLED display device 1 may include a plurality of pixels.The display area DA may include multiple-color light-emitting areas, andone pixel corresponds to one light-emitting area. The display area DAmay be used not only as an area for displaying an image, but also as anarea for recognizing touch input from a user.

The OLED display device 1 may display an image in the display area DA(or on a front display surface thereof). The display area DA may begenerally parallel to a surface defined by a first directional axis(i.e., an axis extending in a first direction dr1) and a seconddirectional axis (i.e., an axis extending in a second direction dr2).The normal direction of the display surface, i.e., the thicknessdirection of the OLED display device 1, may be defined as a thirddirection dr3.

The front (or top) surfaces and the rear (or bottom) surfaces of theelements or units of the OLED display device 1 may be defined withrespect to the third direction dr3. However, the first, second, andthird directions dr1, dr2, and dr3 are exemplary and may thus bereplaced with other directions. The first, second, and third directionsdr1, dr2, and dr3 refer to the same directions throughout theaccompanying drawings.

In one embodiment, the OLED display device 1 may include a flat displayarea DA, but the inventive concepts are not limited thereto. In otherembodiments, the OLED display device 1 may include a curved display areaor a stereoscopic display area. The stereoscopic display area mayinclude multiple display areas indicating different directions and mayinclude, for example, a polygonal columnar display surface.

The non-display area NDA is defined as an area in which no image isdisplayed. The non-display area NDA includes a first non-display areaNDA surrounding the display area DA and a second non-display area NDA2disposed inside the display area DA.

The display area DA may have a rectangular shape and may have roundedcorners. The first non-display area NDA1 may surround the display areaDA, but the inventive concepts are not limited thereto. The shapes ofthe display area DA and the first non-display area NDA1 may be designedin relation to each other. A speaker module, a camera module, and thelike may be disposed in a part of the first non-display area NDA1.

In one embodiment, the OLED display device 1 may include the secondnon-display area NDA2, which is formed to be surrounded by the displayarea DA. That is, the second non-display area NDA2 may be disposedinside the display area DA. The second non-display area NDA2 is definedas an area which includes a hole AH (or an inner groove) and in which noimage is displayed.

In one embodiment, the hole AH may have a circular shape in a plan view.The hole AH may be in a cylindrical shape, but the inventive conceptsare not limited thereto. That is, the hole AH may have various shapesother than a cylindrical shape. In some embodiments, the hole AH mayhave a polygonal shape or an irregular shape in a plan view, in whichcase, the hole AH may be in the shape of a polygonal or irregularcolumn.

Since the OLED display device 1 includes the hole AH, a thin displaydevice can be realized.

The second non-display area NDA2 may include a main hole area MH, whichoverlaps with the hole AH, a groove area GA, and a peripheral area AHA.The peripheral area AHA may be disposed between the main hole area MHand the display area DA.

A camera module and a sensor module may be disposed on a lower side ofthe OLED display device 1 (e.g., on the rear surface opposite to thefront surface of a light-emitting substrate 1000 of FIG. 2). In oneembodiment, the sensor module may include at least one of an ambientlight sensor, a proximity sensor, an infrared sensor, and an ultrasonicsensor. That is, the camera module and the sensor module may be disposedwithin and/or to overlap with the hole AH.

The expression “two elements overlap with each other”, as used herein,means that the two elements overlap with each other in the thicknessdirection of the OLED display device 1 (i.e., the third direction dr3),unless specified otherwise.

As described above with reference to FIG. 1, the OLED display device 1includes the hole AH, which is formed in the second non-display areaNDA2, and the camera module and the sensor module are disposed tooverlap with the hole AH. Thus, dead space in the OLED display device 1can be minimized as compared to a case where the camera module and thesensor module are disposed only in the first non-display area NDA1.

The OLED display device 1 may be a rigid device, but the inventiveconcepts are not limited thereto. Alternatively, the OLED display device1 may be a flexible device. FIG. 1 illustrates an exemplary OLED displaydevice 1 that is applicable to a smartphone. Electronic modules mountedon a main board, a camera module, a power module, and the like may bearranged in a bracket/case together with the OLED display device 1 toform a smartphone.

The OLED display device 1 may include the light-emitting substrate 1000,an input sensing unit 50, an anti-reflection unit 60, and a window unit70. At least some of the light-emitting substrate 1000, the inputsensing unit 50, the anti-reflection unit 60, and the window unit 70 maybe formed by continuous processes and may be bonded to one another by anadhesive member. An optically clear adhesive (OCA) may be used as theadhesive member, but the inventive concepts are not limited thereto. Theadhesive member may include a typical adhesive. In other embodiments,the anti-reflection unit 60 and the window unit 70 may be replaced withother elements or may be omitted.

The light-emitting substrate 1000 may generate light. In one embodiment,the light-emitting substrate 1000 may be a light-emitting display unitor an OLED display panel. The light-emitting substrate 1000 may includea first substrate 10, which becomes a base layer, and a circuit layer20, a light-emitting element layer 30, which includes an organiclight-emitting material, and an encapsulation layer 40, and the circuitlayer 20, the light-emitting element layer 30, and the encapsulationlayer 40 are sequentially disposed on the first substrate 10.

Here, units formed together by continuous processes may be referred toas “layers”, and units coupled together by an adhesive member may becollectively referred to as “panels”. A “panel” includes a base layer(such as, for example, a synthetic resin film, a composite film, or aglass substrate), which provides a base surface, but a “layer” has nobase layer. That is, a unit referred to as a “layer” may be disposed ona base surface provided by another unit.

The input sensing unit 50, the anti-reflection unit 60, and the windowunit 70 may be referred to as an input sensing panel, an anti-reflectionpanel, and a window panel, respectively, or as an input sensing layer,an anti-reflection layer, and a window layer, respectively, depending onwhether they have a base layer.

The hole AH may be formed through the front and rear surfaces of each ofthe light-emitting substrate 1000, the input sensing unit 50, and theanti-reflection unit 60 of the OLED display device 1. That is, each ofthe light-emitting substrate 1000, the input sensing unit 50, and theanti-reflection unit 60 may include a hole (or a through hole)corresponding to the hole AH.

In one embodiment, the window unit 70 may not include the hole AH, butmay cover the main hole area MH, but the inventive concepts are notlimited thereto. Alternatively, the hole AH may be formed to penetratethe window unit 70.

The input sensing unit 50 may acquire coordinate information of externalinput (e.g., a touch event). The input sensing unit 50 may be a touchsensing unit detecting touch input from the user or a fingerprintsensing unit detecting fingerprint information from a finger of theuser. The pitch and width of detection electrodes (i.e., detectionelectrodes (510 and 520) included in the input sensing unit 50) may varydepending on the purpose of use of the input sensing unit 50. Forexample, the detection electrodes of a touch sensing unit may have awidth of several to dozens of millimeters, and the detection electrodesof a fingerprint sensing unit may have a width of dozens to hundreds ofmicrometers. The input sensing unit 50 will hereinafter be described asbeing a touch sensing unit.

The input sensing unit 50 may overlap with the display area DA. Theinput sensing unit 50 may not overlap with the hole AH, but may overlapwith some of the second non-display area NDA2 excluding the hole AH.This will be described later with reference to FIG. 10.

The anti-reflection unit 60 may reduce the reflectance of external lightincident from above the window unit 70.

In one embodiment, the anti-reflection unit 60 may include a retarderand a polarizer. The phase retarder may be of a film type or a liquidcrystal coating type, and may include a λ/2 retarder and/or a λ/4retarder. The polarizer may also be of a film type or a liquid crystalcoating type. A film-type polarizer may include a stretch-type syntheticresin film, and a liquid crystal coating-type polarizer may includeliquid crystal molecules arranged in a predetermined fashion. Theanti-reflection unit 60 may further include a protective film. Eitherthe retarder and the polarizer or the protective film may be defined asthe base layer of the anti-reflection unit 60.

In one embodiment, the anti-reflection unit 60 may include colorfilters. The color filters may be arranged in a predetermined fashion.The pattern of arrangement of the color filters may be determined inconsideration of colors emitted from the pixels included in thelight-emitting substrate 1000. The anti-reflection unit 60 may furtherinclude black matrices adjacent to the color filters.

The window unit 70 may protect the light-emitting substrate 1000 and theinput sensing unit 50 from external scratches or the like. The topsurface of the window unit 70 may be a surface that is to be in contactwith the user's input means (e.g., a finger).

The window unit 70 may include a functional coating layer disposed onthe top surface and/or the bottom surface thereof. The functionalcoating layer may include an anti-fingerprint layer, an anti-reflectionlayer, and a hard coating layer. For convenience, detailed descriptionsof the anti-reflection unit 60 and the window unit 70, which are knownin the art, will be omitted.

The layout of the light-emitting substrate 1000 will hereinafter bedescribed with reference to FIGS. 3 and 4.

FIG. 3 is a plan view illustrating the layout of the light-emittingsubstrate included in the OLED display device according to theembodiment of FIG. 1. FIG. 4 is a circuit diagram illustrating a pixelincluded in the light-emitting substrate of FIG. 3.

Referring to FIG. 3, a display area DA and first and second non-displayareas NDA1 and NDA2 are defined on the light-emitting substrate 1000 ina plan view. The first non-display area NDA1 may be defined along theedges of the display area DA. The display area DA surrounds the secondnon-display area NDA2. The display area DA and the first and secondnon-display areas NDA1 and NDA2 of the light-emitting substrate 1000correspond to the display area DA and the first and second non-displayareas NDA1 and NDA2, respectively, of the OLED display device 1 of FIG.1.

The light-emitting substrate 1000 may include driving circuitry GDC,signal lines SGL, a first pad area TPA1 (or first pad terminals in thefirst pad area TPA1), and a plurality of pixels PX. The pixels PX may bedisposed in the display area DA. Here, the pixels PX are minimal unitsfor displaying an image (or emitting light), and each of the pixels PXincludes a light-emitting element (e.g., an OLED) and pixel drivingcircuits connected to the light-emitting element. The driving circuitryGDC, the signal lines SGL, signal pads, and the pixel driving circuitsof each of the pixels PX may be included in the circuit layer 20 of FIG.2.

The size of the second non-display area NDA2 may be larger than the sizeof the hole AH. That is, a part of the second non-display area NDA2between the hole AH and the display area DA may be an area where nolight is emitted from the light-emitting substrate 1000. This part ofthe second non-display area NDA2 corresponds to the groove area GA andthe peripheral area AHA, which will be described later with reference toFIG. 9. The pixels PX may not be disposed in the groove area GA and theperipheral area AHA.

The driving circuitry GDC may include a scan driving circuit. The scandriving circuit generates scan signals and sequentially outputs the scansignals to scan lines GL, which will be described later. The scandriving circuit may further output control signals to the drivingcircuits of the pixels PX.

The scan driving circuit may include a plurality of thin-filmtransistors (TFTs) formed by the same process as the driving circuits ofthe pixels PX, for example, a low temperature polycrystalline silicon(LTPS) process or a low temperature polycrystalline oxide (LTPO)process.

The signal lines SGL include the scan lines GL, data lines DL, a powerline PL, and a control signal line CSL. The scan lines GL are connectedto the pixels PX, and the data lines DL are connected to the pixels PX.The power line PL is connected to the pixels PX. The control signal lineCSL may provide control signals to the scan driving circuit.

The signal lines SGL overlap with the display area, the firstnon-display area NDA1, and the second non-display area NDA2 except for apart overlapping with the hole AH. The signal lines SGL may be connectedto a first pad area TPA1 in the first non-display area NDA1 (i.e., anarea in which the first pad terminals are disposed) and may also beconnected to the pixels PX.

Each of the signal lines SGL are connected to transistors (TRd and TRs)of each of the pixels PX. The signal lines SGL may have a single- ormultilayer structure. Each of the signal lines SGL may be formed as asingle body or may include two or more parts, in which case, the two ormore parts may be disposed in different layers and may be connected toeach other via a contact hole that penetrates an insulating layerdisposed between the two or more parts.

The light-emitting substrate 1000 may include a hole AH, whichcorresponds to the hole AH of the OLED display device 1. The hole AH ofthe light-emitting substrate 1000 overlaps with the main hole area MH ofthe OLED display device 1.

The signal lines SGL extend in the first direction dr1 and/or in thesecond direction dr2 in the display area DA. For example, the data linesDL may extend in the first direction dr1, and the scan lines GL mayextend in the second direction dr2. The power line PL may include a partextending in the first direction dr1 and a part extending in the seconddirection dr2.

Some of the data lines DL, some of the scan lines GL, and a part of thepower line PL may be disposed to bypass the hole AH. In this case, someof the signal lines SGL that bypass the hole AH may be disposed in thesecond non-display area NDA2 (particularly, in the peripheral area AHA).The pixels PX are not disposed in the main hole area MH.

A circuit board may be electrically connected to the first pad areaTPA1. The circuit board may be a rigid circuit board or a flexiblecircuit board. The circuit board may be directly coupled to the firstpad area TPA1 or may be connected to the first pad area TPA1 via anothercircuit board.

Referring to FIG. 4, an OLED “OLED” of a pixel PX may be of a topemission type or a bottom emission type. The pixel PX may include aswitching transistor TRs, a driving transistor TRd, and a sustaincapacitor Cst as pixel driving circuits for driving the OLED “OLED”.

A first power supply voltage ELVDDD is provided to the drivingtransistor TRd, and a second power supply voltage ELVSS is provided tothe OLED “OLED”. The second power supply voltage ELVSS may be lower thanthe first power supply voltage ELVDD.

The switching transistor TRs outputs a data signal applied to a dataline DL in response to a scan signal applied to a scan line GL. Thesustain capacitor Cst is charged with a voltage corresponding to thedata signal received from the switching transistor TRs. The drivingtransistor TRd is connected to the OLED “OLED”. The driving transistorTRd controls a driving current that flows in the OLED “OLED” inaccordance with the amount of charge stored in the sustain capacitorCst.

The equivalent circuit illustrated in FIG. 4 is merely exemplary, andthe structure of the pixel PX is not limited thereto. For example, thepixel PX may further include at least one transistor and may includemore than one capacitor. The OLED “OLED” may be connected between apower line PL and the driving transistor TRd.

The layout of the input sensing unit 50 and the stack structure of theOLED display device 1 will hereinafter be described with reference toFIGS. 5 through 10.

FIG. 5 is a plan view illustrating the layout of the input sensing unitincluded in the OLED display device according to the embodiment ofFIG. 1. FIG. 6 is an enlarged plan view illustrating an area FF1 of FIG.5. FIG. 7 is a cross-sectional view taken along line I1-I1′ of FIG. 6.FIG. 8 is a cross-sectional view taken along line I2-I2′ of FIG. 6. FIG.9 is an enlarged plan view illustrating an area FF2 of FIG. 5. FIG. 10is a cross-sectional view taken along line I3-I3′ of FIG. 9.

Referring to FIGS. 5 through 10, the input sensing unit 50 may have amultilayer structure. The input sensing unit 50 may include detectionelectrodes (510 and 520), at least one touch conductive layer includingsignal lines (530, 550, 540, 560, and 570), which are connected to thedetection electrodes (510 and 520), and at least one touch insulatinglayer. For example, the input sensing unit 50 may detect external inputin a capacitive manner, but the inventive concepts are not limitedthereto. In another example, the input sensing unit 50 may detectexternal input in an electromagnetic induction manner or a pressuresensing manner.

In one embodiment, the input sensing unit 50 may include a first touchconductive layer, a first touch insulating layer 501, a second touchconductive layer, and a second touch insulating layer 502, which aresequentially stacked. The input sensing unit 50 may further include,below the first conductive layer, a buffer layer for forming the firsttouch conductive layer, the first touch insulating layer 501, the secondtouch conductive layer, and the second touch insulating layer 502. Thebuffer layer may be omitted, but the inventive concepts are not limitedthereto.

Each of the first and second touch conductive layers may have asingle-layer structure or a multilayer structure consisting of layersthat are stacked along the third direction dr3. When having asingle-layer structure, each of the first and second touch conductivelayers may include a metal layer or a transparent conductive layer. Themetal layer may include molybdenum (Mo), silver (Ag), titanium (Ti),copper (Cu), aluminum (Al), or an alloy thereof. The transparentconductive layer may include a transparent conductive oxide such asindium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), orindium tin zinc oxide (ITZO). The transparent conductive layer may alsoinclude a conductive polymer such as poly(3,4-ethyelenedioxythiophene)(PEDOT), metal nanowires, or graphene. When having a multilayerstructure, each of the first and second touch conductive layers mayinclude multilayer metal layers. The multilayer metal layers may have atriple-layer structure of, for example, titanium (Ti)/aluminum(Al)/titanium (Ti). When having a multilayer structure, each of thefirst and second touch conductive layers may include at least one metallayer and at least one transparent conductive layer.

The stack structure and the material of the detection electrodes (510and 520) may be determined in consideration of sensing sensitivity.Detection electrodes 510 and 520 including transparent conductivelayers, unlike their counterparts including metal layers, are notvisible to the user and can widen an input area to increase capacitance.RC delays may affect sensing sensitivity. Since the detection electrodes(510 and 520) have lower resistance when including metal layers thanwhen including transparent conductive layers, RC values can be lowered,and the amount of time that it takes to charge capacitors definedbetween the detection electrodes (510 and 520) may decrease. Whenincluding metal layers, the detection electrodes (510 and 520) may havea mesh shape, in which case, the metal layers may not be visible to theuser.

The first and second touch insulating layers 501 and 502 may have asingle- or multilayer structure. Each of the first and second touchinsulating layers 501 and 502 may include an inorganic material, anorganic material, or a composite material.

Each of the first and second touch insulating layers 501 and 502 mayinclude an organic film and/or an inorganic film. The inorganic film mayinclude at least one of aluminum oxide, titanium oxide, silicon oxide,silicon oxynitride, zirconium oxide, and hafnium oxide. The organic filmmay include at least one of an acrylic resin, a methacrylic resin,polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, acellulose resin, a siloxane resin, a polyimide resin, a polyamide resin,and a perylene resin.

The input sensing unit 50 may include first detection electrodes 510,second detection electrodes 520, first signal lines 530, second signallines 550, third signal lines 540, and fourth signal lines 560. Theinput sensing unit 50 may further include second pad terminals disposedin a second pad area TPA2.

In the embodiment of FIGS. 5 through 10, the first detection electrodes510 may be sensing electrodes, and the second detection electrodes 520may be driving electrodes. In other embodiments, the first detectionelectrodes 510 may be driving electrodes, and the second detectionelectrodes 520 may be sensing electrodes.

The first detection electrodes 510 and the second detection electrodes520 may be disposed in a sensing area AA, which is defined as an areawhere input can be detected. Here, the sensing area AA may correspondto, and overlap with, the display area DA. That is, the sensing area AAand the display area DA of the OLED display device 1 may be the same.

The first detection electrodes 510 may extend in the second directiondr2 and may be arranged repeatedly along the first direction dr1. Thesecond detection electrodes 520 may extend in the first direction dr1and may be arranged repeatedly along the second direction dr2. The firstdetection electrodes 510 may transmit sensing signals, and the seconddetection electrodes 520 may transmit detection signals.

The first detection electrodes 510 and the second detection electrodes520 intersect one another. In this case, the input sensing unit 50 maydetect external input in a mutual capacitance manner and/or aself-capacitance manner, as is known in the art. The input sensing unit50 may calculate the coordinates of external input in the mutualcapacitance manner during a first period and may recalculate thecoordinates of the external input in the self-capacitance manner duringa second period.

Each of the first detection electrodes 510 includes first sensormembers, which may be in the form of sensing electrodes 511, and firstconnecting members 512. Similarly, each of the second detectionelectrodes 520 includes second sensor members, which may be in the formof driving electrodes 521, and second connecting members (522 a and 522b).

In each of the first detection electrodes 510, the first sensor members511 may be arranged along the second direction dr2, and pairs ofadjacent first sensor members 511 may be connected to one another viathe first connecting members 512. In each of the second detectionelectrodes 520 may be arranged along the first direction dr1, and pairsof adjacent second sensor members 521 may be connected via the secondconnecting members (522 a and 522 b).

The input sensing unit 50 may include i first detection electrodes 510(where i is an integer of 2 or greater) and j second detectionelectrodes 520 (where j is an integer of 2 or greater). For convenience,the input sensing unit 50 is illustrated as including eight firstdetection electrodes 510 and five second detection electrodes 520, butthe inventive concepts are not limited thereto.

The first signal lines 530, the second signal lines 550, the thirdsignal lines 540, and the fourth signal lines 560 may be disposed in afirst non-sensing area NAA1. Here, the first non-sensing area NAA1 maycorrespond to, and overlap with, the first non-display area NDA1. Thatis, the first non-sensing area NAA1 and the first non-display area NDA1of the OLED display device 1 may be the same.

The first signal lines 530 may extend from some of the second padterminals in the second pad area TPA2 along a part of the firstnon-sensing area NAA1 disposed on a first side (e.g., on the right side)of the input sensing unit 50 and may be connected to first ends of thefirst detection electrodes 510. The first signal lines 530 may includefirst through i-th sensing signal lines, and the first through i-thsensing signal lines may be electrically connected to the first ends ofthe first detection electrodes 510. For example, the first signal lines530 may include as many sensing signal lines as there are firstdetection electrodes 510, i.e., first through eighth sensing signallines 531 through 538, but the inventive concepts are not limitedthereto.

The second signal lines 550 may extend from other second pad terminalsin the second pad area TPA2 to a third side (e.g., a lower side) of theinput sensing unit 50 and may be electrically connected to first ends ofthe second detection electrodes 520. The second signal lines 550 mayinclude first through j-th detection signal lines, and the first throughj-th detection signal lines may be electrically connected to the firstends of the second detection electrodes 520. For example, the secondsignal lines 550 may include as many detection signal lines as there aresecond detection electrodes 520, i.e., first through fifth detectionsignal lines 551 through 555, but the inventive concepts are not limitedthereto.

The third signal lines 540 may extend from still other second padterminals in the second pad area TPA2 along a part of the firstnon-sensing area NAA1 disposed on a second side (e.g., on a left side)of the input sensing unit 50 and may be connected to second ends of thesecond detection electrodes 520. The third signal lines 540 may include(j+1)-th through (j+j)-th detection signal lines, and the (j+1)-ththrough (j+j)-th detection signal lines may be electrically connected tothe second ends of the second detection electrodes 520. For example, thethird signal lines 540 may include as many detection signal lines asthere are second detection electrodes 520, i.e., sixth through tenthdetection signal lines 541 through 545, but the inventive concepts arenot limited thereto.

The fourth signal lines 560 may extend from yet other second padterminals in the second pad area TPA2 along the first and second sidesof the input sensing unit 50 and may be disposed to surround the firstsignal lines 530, the second signal lines 550, and the third signallines 540. In one embodiment, the fourth signal lines 560 may beantistatic wires. The fourth signal lines 560 may include first andsecond antistatic wires 561 and 562. The first and second antistaticwires 561 and 562 may not be connected to each other.

The first antistatic wire 561 may cover wires disposed on the right sideof the first non-sensing area NAA1 and some wires disposed on the lowerside of the first non-sensing area NAA1. The second antistatic wire 562may cover wires located on the left and upper sides of the firstnon-sensing area NAA1 and other wires disposed on the lower side of thefirst non-sensing area NAA1.

The first and second antistatic wires 561 and 562 may be wires where apredetermined voltage signal flows or no voltage signal flows. The firstand second antistatic wires 561 and 562 can alleviate electrostaticimpact that may be caused to the first signal lines 530, the secondsignal lines 550, and the third signal lines 540.

Fifth signal lines 570 may extend from yet still other second padterminals in the second pad area TPA2 along the first and second sidesof the first non-sensing area NAA1 and may be disposed between the firstsignal lines 530, the second signal lines 550, the third signal lines540, and the fourth signal lines 560. In one embodiment, the fifthsignal lines 570 may be guard wires. The fifth signal lines 570 mayinclude first through fourth guard wires 571 through 574.

For example, the first guard wire 571 may be disposed between the firstsignal lines 530, which extend along the right side of the firstnon-sensing area NAA1, and the first antistatic wire 561. The secondguard wire 572 may be disposed between the first signal lines 530 andthe second signal lines 550. The third guard wire 572 may be disposedbetween the second signal lines 550 and the third signal lines 540. Thefourth guard wire 574 may be disposed between the third signal lines 540and the fifth signal lines 570.

The fifth signal lines 570 may be wires where a predetermined voltagesignal flows or no voltage signal flows. The fifth signal lines 570 canprevent signal interference between adjacent wires.

The arrangement of, and the connections between, the first sensormembers 511 and the arrangement of, and the connections between, thesecond sensor members 521 will hereinafter be described with referenceto FIGS. 6 through 8.

As illustrated in FIG. 6, the first detection electrodes 510 and thesecond detection electrodes 520 may have a mesh shape. The first sensormembers 511, the second sensor members 521, the first connecting members512, and the second connecting members (522 a and 522 b) may includemesh lines. The mesh lines may include lines (511 b and 521 b) extendingin a fourth direction dr4 and lines (511 a and 521 b) extending in afifth direction dr5. Here, the fourth and fifth directions dr4 and dr5may be defined on the same plane as the first and second directions dr1and dr2. For example, the fourth direction dr4 may be an upper leftdirection, and the fifth direction dr5 may be an upper right direction.

The distance between the first sensor members 511 and the distancebetween the second sensor members 521 may be several nanometers or lessbecause the mesh lines are separated (or disconnected) so that theboundaries between first pixel electrodes 311 can become distinctive.

The second connecting members (522 a and 522 b) may be disposed in adifferent layer from the first sensor members 511, the second sensormembers 521, and the first connecting members 512. In one embodiment,the first sensor members 511, the second sensor members 521, and thefirst connecting members 512 may be disposed in the second touchconductive layer, and the second connecting members (522 a and 522 b)may be disposed in the first touch conductive layer. The second sensormembers 521, which are spaced apart from one another, may be connectedto the second connecting members (522 a and 522 b) via first contactholes CNT1, which penetrate the first touch insulating layer 501. Thefirst sensor members 511 may be partially removed to reduce theoverlapping areas with the second connecting members (522 a and 522 b).In another embodiment, the first sensor members 511, the second sensormembers 521, and the first connecting members 512 may be disposed in thefirst touch conductive layer, and the second connecting members (522 aand 522 b) may be disposed in the second touch conductive layer.

At least one first detection electrode 510 and at least one seconddetection electrode 520 that are adjacent to, or intersect, the hole AHmay be separated by the hole AH. That is, some of the first sensormembers 511 of the first detection electrode 510 that is adjacent to, orintersects, the hole AH and some of the second sensor members 521 of thesecond detection electrode 520 that is adjacent to, or intersects, thehole AH may be spaced apart from one another by the hole AH.

The input sensing unit 50 may include first sensor members 511 that areadjacent to, and isolated from each other by, the hole AH and secondsensor members 521 that are adjacent to, and isolated from each otherby, the hole AH and are spaced apart from each other by the hole AH. Thehole AH may be disposed such that the first sensor members 511 that areadjacent to, and isolated from each other by, the hole AH, may havesubstantially the same area, and that the second sensor members 521 thatare adjacent to, and isolated from each other by, the hole AH, may havesubstantially the same area. That is, the center of the hole AH maycoincide with the median point between the first sensor members 511 thatare adjacent to, and isolated from each other by, the hole AH and withthe median point between the second sensor members 521 that are adjacentto, and isolated from each other by, the hole AH. In this manner, theareas of the first sensor members 511 and the second sensor members 521can become relatively uniform, and as a result, sensing sensitivity canbe prevented from being lowered.

The input sensing unit 50 may further include connectors. The Connectorsmay include connecting wires (511 c and 521 c) (or touch sensing wires).The Connectors may electrically connect the first sensor members 511that are adjacent to, and isolated from each other by, the hole AH andmay electrically connect the second sensor members 521 that are adjacentto, and isolated from each other by, the hole AH. The connecting wires(511 c and 521 c) may be disposed between the main hole area MR of thesecond non-sensing area NAA2 and the sensing area AA.

The connecting wires (511 c and 521 c) may be formed on the same plane(or in the same layer) as the first sensor members 511 and the secondsensor members 521. In one embodiment, the connecting wires (511 c and521 c) may be disposed in the second touch conductive layer togetherwith the first sensor members 511 and the second sensor members 521.

The width of the main hole area MR may be determined by the size of thehole AH. For example, as the size of the hole AH increases, the width ofthe main hole area MH increases, and as the size of the hole AHdecreases, the width of the main hole area MH may decrease and may besaturated to a predetermined value.

A first connecting wire 511 c may bypass the main hole area MH along oneside (e.g., an upper side) of the main hole area MH and may electricallyconnect the first sensor members 511, which are spaced apart from oneanother. Similarly, a second connecting wire 521 c may bypass the mainhole area MH along another side (e.g., a right side) of the main holearea MH and may electrically connect the second sensor members 521,which are spaced apart from one another.

The first and second connecting wires 511 c and 521 c may have apredetermined linewidth. For example, the first and second connectingwires 511 c and 521 c may have a greater line width than the signallines SGL (having a line width of, for example, several micrometers).

The first and second connecting wires 511 c and 521 c may be arrangedalong a relatively short path and may overlap with each other becausetheir extension directions cross each other. However, in order toprevent the first and second connecting wires 511 c and 521 c from beingshort-circuited, a bridge connector in the form of a bridge wire may beprovided in the first touch conductive layer for one of the first andsecond connecting wires 511 c and 521 c. For example, the connectors mayinclude the first and second connecting wires 511 c and 521 c and theconnectors may further include a first bridge wire 512 c. The firstbridge wire 512 c may be provided at the intersection between the firstand second connecting wires 511 c and 521 c so that the first connectingwire 511 c can maintain its electrical connection to the secondconnecting wire 521 c while not being in contact with the secondconnecting wire 521 c due to the first bridge wire 512 c. The firstbridge wire 512 c may be connected to the first connecting wire 511 cvia second contact holes CNT2 of the first touch insulating layer 501,which are formed at both ends of the first bridge wires 512 c.

The second non-sensing area NAA2 may include the main hole area MH,which includes the center of the second non-sensing area NDA2, thegroove area GA, and the peripheral area AHA. The groove area GA may bean area including grooves (GRV1, GRV2, and GRV3) and may be disposedbetween the main hole area MH and the peripheral area AHA.

The peripheral area AHA, which accounts for an edge part of the secondnon-sensing area NDA2, may be disposed between the groove area GA andthe sensing area AA. The light-emitting substrate 1000 may not includethe grooves (GRV1, GRV2, and GRV3) in the peripheral area AHA. In boththe display area DA and the peripheral area AHA, the light-emittingsubstrate 1000 may include parts in which the sum of the thicknesses oflayers ranging from the first substrate 10 to a thin-film encapsulationlayer 410 are substantially the same.

The second non-display area NDA2 may also include the main hole area MH,the groove area GA, and the peripheral area AHA, and the main hole areaMH, the groove area GA, and the peripheral area AHA of the secondnon-display area NDA2 may be substantially the same as the main holearea MH, the groove area GA, and the peripheral area AHA, respectively,of the second non-sensing area NAA2.

The first and second connecting wires 511 c and 521 c bypass the mainhole area MH mostly from the groove area GA. On the other hand, thesignal lines SGL bypass the main hole area MH mostly from the peripheralarea AHA. In the second non-display area NDA2, the data lines DL, thescan lines GL, and the power line PL may be disposed to bypass the mainhole area MH mostly from the peripheral area AHA, and the first andsecond connecting wires 511 c and 521 c may be disposed to bypass themain hole area MH mostly from the groove area GA. Thus, signalinterference between the signal lines SGL and the connecting wires (511c and 521 c) can be reduced. Also, dead space between the hole AH andthe display area AA can be reduced as compared to a case where theconnecting wires (511 c and 521 c) are disposed to pass through theperipheral area AHA.

The cross-sectional structure of the OLED display device 1 and parts ofthe second non-display area NDA2 will hereinafter be described withreference to FIGS. 7, 8, and 10.

The first substrate 10 may be the base substrate of the light-emittingsubstrate 1000. The first substrate 10 may include a first sub-baselayer 101 (or a supporting substrate), a first barrier layer 111, asecond sub-base layer 102 (or a flexible substrate), and a secondbarrier layer 112. The first barrier layer 111 may be disposed on thefirst sub-base layer 101, the second sub-base layer 102 may be disposedon the first barrier layer 111, and the second barrier layer 112 may bedisposed on the second sub-base layer 102. Each of the first and secondsub-base layers 101 and 102 may include a polymer material havingflexibility, such as, for example, polyimide (PI). The first and secondbarrier layers 111 and 112 may have a barrier characteristic and mayprevent external oxygen and moisture from infiltrating into the firstand second sub-base layers 101 and 102.

The first non-display area NDA1, the display area DA, and the secondnon-display area NDA2 may be defined on the first substrate 10. The mainhole area MH, the groove area GA, and the peripheral area AHA of thesecond non-display area NDA2 may also be defined on the first substrate10.

A plurality of recesses, which may be in the form of grooves (GRV1,GRV2, and GRV3) are defined near the hole AH. The grooves (GRV1, GRV2,and GRV3) may be recessed from the front surface of the first substrate10 toward the rear surface of the OLED display device 1. The grooves(GRV1, GRV2, and GRV3) may be formed by removing at least some parts ofthe first substrate 10. Specifically, the grooves (GRV1, GRV2, and GRV3)may be formed by removing at least some parts of the first substrate 10in a direction from the front surface to the rear surface of the firstsubstrate 10. For example, the grooves (GRV1, GRV2, and GRV3) may beformed by removing the second sub-base layer 102. In another example,the grooves (GRV1, GRV2, and GRV3) may be formed by removing at leastsome parts of each of the second barrier layer 112, the second sub-baselayer 102, the first barrier layer 111, and the first sub-base layer101.

The grooves (GRV1, GRV2, and GRV3) may be formed to be recessed from thefront surface of the first substrate 10. Each of the grooves (GRV1,GRV2, and GRV3) may have the shape of a closed curve surrounding thehole AH in a plan view. Each of the grooves (GRV1, GRV2, and GRV3) mayhave an annular shape surrounding the hole AH in a plan view. Thegrooves (GRV1, GRV2, and GRV3) may have a larger diameter than the holeAH.

First, second, and third grooves GRV1, GRV2, and GRV3 may be spacedapart from one another. The diameter of the third groove GRV3 may begreater than the diameter of the second groove GRV2, and the diameter ofthe second groove GRV2 may be greater than the diameter of the firstgroove GRV1.

The first, second, and third grooves GRV1, GRV2, and GRV3 areillustrated as having substantially the same width and havingsubstantially the same distance therebetween, but the inventive conceptsare not limited thereto. Also, the OLED display device 1 is illustratedas having three grooves surrounding the hole AH, but the inventiveconcepts are not limited thereto. Alternatively, the OLED display device1 may include less than three or four or more grooves.

The second sub-base layer 102 may include negative polyimide. In thiscase, grooves (GRV1, GRV2, and GRV3) having undercut-shape innersurfaces may be formed through patterning. That is, protruding tips maybe formed at the grooves (GRV1, GRV2, and GRV3). Due to the grooves(GRV1, GRV2, and GRV3) (and the protruding tips), a light-emitting layer312 (or an organic light-emitting layer) may be discontinuously formedin the process of stacking the layers of the light-emitting substrate1000. The grooves (GRV1, GRV2, and GRV3) may be formed by laser etching.

In one embodiment, the light-emitting substrate 1000 may include thefirst, second, and third grooves GRV1, GRV2, and GRV3. The first grooveGRV1 may be disposed relatively close to the main hole area MH, thethird groove GRV3 may be disposed relatively close to the peripheralarea AHA, and the second groove GRV2 may be disposed between the firstand third grooves GRV1 and GRV3.

By defining the grooves (GRV1, GRV2, and GRV3) near the hole AH, thepath of penetration of oxygen or moisture from the hole AH can bedisconnected.

The circuit layer 20 includes a buffer layer 201, semiconductor layersAE, a first insulating layer 211, a first conductive layer, a secondinsulating layer 212, a second conductive layer, a third insulatinglayer 221, a third conductive layer, and a fourth insulating layer 222.Each of these layers may be formed as a single- or multilayer film, andother layers may be further disposed between these layers. In otherembodiments, some of these layers may be omitted.

The buffer layer 201 may be disposed on the entire surface of the firstsubstrate 10. The buffer layer 201 can prevent the diffusion of impurityions and the penetration of moisture or external air and can perform asurface planarization function. The buffer layer 201 may include siliconnitride, silicon oxide, or silicon oxynitride. The buffer layer 201 maybe omitted depending on the type of the first substrate 10 or processingconditions.

A plurality of TFTs TR including driving transistors TRd and switchingtransistors TRs may be disposed on the buffer layer 201. Forconvenience, only driving transistors TRd are illustrated, but theinventive concepts are not limited thereto. That is, other TFTsincluding switching transistors TRs may also be disposed. At least onedriving transistor TRd may be provided in each pixel PX.

The driving transistors TR may include the semiconductor layers AE, gateelectrodes GE, source electrodes SE, and drain electrodes DE.Specifically, the semiconductor layers AE are disposed on the bufferlayer 201. The semiconductor layers AE may include amorphous silicon,polysilicon, low-temperature polysilicon, or an organic semiconductor.Alternatively, the semiconductor layers AE may be an oxidesemiconductor. Although specifically illustrated, each of thesemiconductor layers AE may include a channel region and source anddrain regions disposed on both sides of the channel region and dopedwith impurities.

The first insulating layer 211 is disposed on the semiconductor layersAE. The first insulating layer 211 may be a gate insulating film. Thefirst insulating layer 211 may include a silicon compound or a metaloxide. For example, the first insulating layer 211 may include siliconoxide (SiOx), silicon oxynitride, aluminum oxide, tantalum oxide,hafnium oxide, zirconium oxide, or titanium oxide. These materials maybe used alone or in combination with one another. The first insulatinglayer 211 may be a single-layer film or a multilayer film consisting ofa stack of different materials.

The first conductive layer is disposed on the first insulating layer211. The first conductive layer may be disposed to at least partiallyoverlap with the semiconductor layers AE. The first conductive layer mayinclude the gate electrode GE.

The first conductive layer may include at least one metal selected fromamong aluminum (Al), platinum (Pt), palladium (Pd), silver, magnesium(Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium(Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), andcopper (Cu). The first conductive layer may be a single- or multilayerfilm.

The second insulating layer 212 is disposed on the first conductivelayer. The second insulating layer 212 covers the first conductivelayer. The second insulating layer 212 may be a gate insulating filmhaving a gate insulation function. The second insulating layer 212 mayinclude the same material as the first insulating layer 211 or mayinclude at least one selected from among the above-described exemplarymaterials of the first insulating layer 211. The second insulating layer212 may be a single-layer film or a multilayer film consisting of astack of different materials.

The second conductive layer is disposed on the second insulating layer212. The second conductive layer may be disposed to at least partiallyoverlap with the semiconductor layers AE and the gate electrodes GE. Thesecond conductive layer may include the same material as the firstconductive layer or may include at least one selected from among theabove-described exemplary materials of the first conductive layer. Thesecond conductive layer may be a single-layer film or a multilayer filmconsisting of a stack of different materials.

The second conductive layer may include the sustain capacitor Cst ofFIG. 3 and some of the signal lines SGL.

The third insulating layer 221 may be disposed on the second conductivelayer. The third insulating layer 221 covers the second conductivelayer. The third insulating layer 221 may be an interlayer insulatingfilm.

The third insulating layer 221 may include an inorganic insulatingmaterial such as silicon oxide (SiOx), silicon nitride (SiNx), siliconoxynitride, hafnium oxide, aluminum oxide, titanium oxide, tantalumoxide, or zinc oxide or an organic insulating material such as anacrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, apolyimide resin, an unsaturated polyester resin, a polyphenylene resin,a polyphenylene sulfide resin, or benzocyclobutene (BCB). The thirdinsulating layer 221 may be a single-layer film or a multilayer filmconsisting of a stack of different materials.

The third conductive layer is disposed on the third insulating layer221. The third conductive layer may include the source electrodes SE andthe drain electrodes DE, which electrically connect the first pixelelectrodes 311 and the semiconductor layers AE, and some of the signallines SGL. The third conductive layer may be formed of a metal materialhaving conductivity. For example, the source electrodes SE and the drainelectrodes DE may include aluminum, copper, titanium, or molybdenum.

The fourth insulating layer 222 is disposed on the third conductivelayer. The fourth insulating layer 222 covers the third conductivelayer. The fourth insulating layer 222 may be a protective layer, apassivation film, and/or a via layer. The fourth insulating layer 222may be formed as a single- or multilayer film including an inorganicmaterial, an organic material, or an organic/inorganic compositematerial and may be formed by various deposition methods. In someembodiments, the fourth insulating layer 222 may be formed of at leastone of an acrylic resin, an epoxy resin, a phenolic resin, a polyamideresin, a polyimide resin, an unsaturated polyester resin, apolyphenylene resin, a polyphenylene sulfide resin, andbenzocyclobutene.

The light-emitting element layer 30 is disposed on the circuit layer 20and includes the first pixel electrodes 311, the light-emitting layer312, and a second pixel electrode 313.

The first pixel electrodes 311 may be disposed on the fourth insulatinglayer 222. The first pixel electrodes 311 may be the anode electrodes ofOLEDs.

The first pixel electrodes 311 may include a material having a high workfunction. The first pixel electrodes 311 may include a conductivematerial such as indium tin oxide, indium zinc oxide, zinc oxide, orindium oxide (In₂O₃). These exemplary conductive materials have arelatively high work function and are transparent. In a case where theOLED display device is of a top emission type, the first pixelelectrodes 311 may further include a reflective material such as silver,magnesium, aluminum, platinum, palladium, gold, nickel, neodymium,iridium, chromium, lithium (Li), calcium, or a mixture thereof.Accordingly, the first pixel electrodes 311 may have a single-layerstructure including a conductive material and a reflective material ormay have a multilayer structure consisting of a stack of a conductivematerial and a reflective material.

A pixel defining film 301 is disposed on the first pixel electrodes 311.The pixel defining film 301 includes openings that expose at least someparts of the first pixel electrodes 311. The pixel defining film 301 mayinclude an organic material or an inorganic material. In one embodiment,the pixel defining film 301 may include photoresist, a polyimide resin,an acrylic resin, a silicon compound, or a polyacrylic resin.

The light-emitting layer 312 is disposed on parts of the first pixelelectrodes 311 exposed by the pixel defining film 301.

The second pixel electrode 313 is disposed on the light-emitting layer312. The second pixel electrode 313 may be a common electrode disposedwithout regard to the distinction between the pixels PX. Also, thesecond pixel electrode 313 may be the cathode electrodes of OLEDs.

The second pixel electrode 313 may be formed of a material having a lowwork function. The second pixel electrode 313 may include Li, Ca,LiF/Ca, LiF/Al, Al, Mg, Ag, Pt, Pd, Ni, Au Nd, Ir, Cr, BaF, Ba, or acompound or mixture thereof (e.g., the mixture of Ag and Mg). The secondpixel electrode 313 may be connected to the power line PL via electrodesformed in the same layer as the first pixel electrodes 311.

The first pixel electrodes 311, the light-emitting layer 312, and thesecond pixel electrode 313 may form OLEDs.

The OLED display device 1 may further include a dam member (DM1 and DM2)in the groove area GA. The dam member (DM1 and DM2) may extend along thegroove area GA.

The dam member (DM1 and DM2) may include first and second dams DM1 andDM2. The second dam DM2 may be closer than the first dam DM1 to theperipheral area AHA.

The first dam DM1 may include the same material as the third insulatinglayer 221. The first dam DM1 and the third insulating layer 221 may beformed at the same time and may be disposed in the same layer. The firstdam DM1 may be disposed between the first and second grooves GRV1 andGRV2.

The first dam DM1 can additionally block the path of penetration ofmoisture or oxygen from the hole AH. Also, the first dam DM1 can preventthe hole AH and its surroundings from being damaged by external impact.

The second dam DM2 may include the same material as the pixel definingfilm 301. The second dam DM2 and the pixel defining film 301 may beformed at the same time and may be disposed in the same layer. Thesecond dam DM2 may be disposed between the second and third grooves GRV2and GRV3.

The second dam DM2 can additionally block the path of penetration ofmoisture or oxygen from the hole AH. Also, the second dam DM2 can definea range in which to form the thin-film encapsulation layer 410.

However, the dam member (DM1 and DM2) is exemplary. The dam member (DM1and DM2) may have a single-layer structure and are not particularlylimited.

The OLED display device 1 may further include a first capping layer 401disposed on the light-emitting element layer 30. The first capping layer401 may be disposed on the entire surface of the first substrate 10. Thefirst capping layer 401 may emit light generated by the light-emittingelement layer 30 to be emitted out of the light-emitting substrate 1000.

The first capping layer 401 may be formed of an inorganic material suchas a fluorinated alkali (e.g., LiF), silicon nitride, silicon oxide, orsilicon oxynitride, or an organic material such as a-NPD, NPB, TPD,m-MTDATA, Alq₃ or CuPc, or an organic/inorganic composite material. Thefirst capping layer 401 may be formed by chemical vapor deposition (CVD)method or atomic layer deposition (ALD). The first capping layer 401 maynot only protect the light emitting device layer 30, but alsoefficiently emit light generated by the organic light emitting diodeOLED. Also, the first capping layer 401 may be a buffer layer forarranging the thin-film encapsulation layer 410. In other embodiments,the first capping layer 401 may be omitted.

The thin-film encapsulation layer 410 is disposed on the first cappinglayer 401 and includes two inorganic films and one organic film.Specifically, the thin-film encapsulation layer 410 includes first andsecond inorganic films 411 and 413 and a first organic film 412 disposedbetween the first and second inorganic films 411 and 413.

For example, the first and second inorganic films 411 and 413 mayinclude at least one monomer selected from among AlxOy, TiOx, ZrOx,SiOx, AlOxNy, AlxNy, SiOxNy, SixNy, ZnOx, and TaxOy. Specifically, thefirst and second inorganic films 411 and 413 may include at least one ofAl₂O₃, TiO₂, ZrO, SiO₂, AlON, AlN, SiON, Si₃N₄, ZnO, and Ta₂O₅. Thefirst and second inorganic films 411 and 413 may be formed by chemicalvapor deposition or atomic layer deposition. In one embodiment, thefirst and second inorganic films 411 and 413 can prevent the penetrationof moisture or oxygen into the light-emitting element layer 30 and thecircuit layer 20.

The first organic film 412 may be formed by polymerizing at least onemonomer selected from the group consisting of pentabromophenyl acrylate,2-(9H-carbazol-9-yl) ethyl methacrylate, N-vinylcarbazole,bis(methacryloylthiophenyl) sulfide, and zirconium acrylate. In oneembodiment, the first organic film 412 may be a planarization film.

In some embodiments, the thin-film encapsulation layer 410 may beconfigured to include all the first capping layer 401, the firstinorganic film 411, the first organic film 412, and the second inorganicfilm 413. In this case, the first capping layer 401 may include lithiumfluoride (LiF).

The second dam DM2 may define an area where a liquid-phase organicmaterial spreads in the process of forming an organic film. The organicfilm may be formed by applying the liquid-phase organic material on thefirst inorganic film 411 via inkjet printing, in which case, the seconddam DM may set the boundaries of an area in which to dispose theliquid-phase organic material and may prevent the liquid-phase organicmaterial from spilling over the dam member (DM1 and DM2).

Second and third capping layers 402 and 403 may be sequentially disposedon the thin-film encapsulation layer 410. The second and third cappinglayers 402 and 403 may include the same material as the first cappinglayer 401 or may include at least one of the above-described exemplarymaterials of the first capping layer 401.

The second capping layer 402 may be formed to have the same area as theencapsulation layer 40. That is, the area in which the second cappinglayer 402 is formed may be defined by the second dam DM2. The thirdcapping layer 403 may be formed on the entire surface of the firstsubstrate 10. The second and third capping layers 402 and 403 can serveas buffer layers on the first capping layer 401 and the thin-filmencapsulation layer 410. Also, the second and third capping layers 402and 403 can prevent the penetration of moisture or oxygen into thelight-emitting element layer 30. In other embodiments, the secondcapping layer 402 and/or the third capping layer 403 may be omitted.

In the hole AH, a dam barrier layer 420 and a hole overcoat layer 430may be sequentially disposed on the third capping layer 403.

The dam barrier layer 420 may be formed even in an area between thefirst and second dams DM1 and DM2. In one embodiment, the dam barrierlayer 420 may extend to the top surfaces of the first and second damsDM1 and DM2.

The hole overcoat layer 430 may be formed over the groove area GA. Thehole overcoat layer 430 may serve as a planarization layer forflattening the light-emitting substrate 1000 by matching the height inthe groove area GA with the top surface of the third capping layer 403in the display area DA, and may also serve as a passivation layer forprotecting the light-emitting substrate 1000.

The hole overcoat layer 430 may be formed of an organic insulatingmaterial including at least one of an epoxy polymer, benzocyclobutene,and photo acryl.

The fourth capping layer 404 may be disposed on the hole overcoat layer430 and the third capping layer 403. The fourth capping layer 404 mayinclude the same material as the first capping layer 401 or may includeat least one of the above-described exemplary materials of the firstcapping layer 401.

The fourth capping layer 404 may be formed on the entire surface of thefirst substrate 10. The fourth capping layer 404 may planarize the topsurface of the light-emitting substrate 1000 and may protect theelements disposed therebelow from the outside. The fourth capping layer404 may serve as a buffer layer on the hole overcoat layer 430. In otherembodiments, the fourth capping layer 404 may be omitted.

The first capping layer 401, the thin-film encapsulation layer 410, thesecond and third capping layers 402 and 403, the hole overcoat layer430, and the fourth capping layer 404 correspond to the encapsulationlayer 40.

The input sensing unit 50 may be disposed on the fourth capping layer404.

OLED display devices according to other embodiments of the inventionwill hereinafter be described. In FIGS. 1 through 37, like referencenumerals indicate like elements, and thus, detailed descriptions thereofwill be omitted to avoid redundancy.

FIG. 11 is an enlarged plan view illustrating a part of an input sensingunit of an OLED display device according to another embodiment of theinvention. FIG. 12 is a cross-sectional view taken along line II1-II1′of FIG. 11. FIGS. 11 and 12 illustrate a modified example of the inputsensing unit 50 of FIGS. 9 and 10.

Referring to FIGS. 11 and 12, an input sensing unit 50 differs from itscounterpart of FIGS. 9 and 10 in that it does not include a first bridgewire 512 c, but includes a second bridge wire 522 c.

The connectors may include the first and second connecting wires 511 cand 521 c and the connectors may further include the second bridge wire522 c. The first and second connecting wires 511 c and 521 c may both bedisposed in a second touch conductive layer and may intersect eachother. In order to prevent the first and second connecting wires 511 cand 521 c from being short-circuited, the second connecting wire 521 cmay be insulated from the first connecting wire 511 c via the secondbridge wire 522 c.

The second connecting wire 521 c may be disconnected from the secondtouch conductive layer at the intersection between the first and secondconnecting wires 511 c and 521 c. The second bridge wire 522 c may bedisposed in a first conductive layer. A first touch insulating layer 501may include third contact holes CNT3, which expose the second bridgewire 522 c. The second connecting wire 521 c may be connected to thesecond bridge wire 522 c via the third contact holes CNT3, and as aresult, a second detection electrode including the second bridge wire522 c can maintain its electrical connection.

FIGS. 13 through 15 are enlarged plan views illustrating parts of inputsensing units of OLED display devices according to other embodiments ofthe invention. FIGS. 13 through 15 illustrate other modified examples ofthe input sensing unit of FIG. 9.

Referring to FIG. 13, an input sensing unit differs from its counterpartof FIG. 9 in that a first connecting wire 511 c bypasses a main holearea MH below a groove area GA.

A second connecting wire 521 c may bypass a central part of a hole AHfrom the left side of the groove area GA.

Referring to FIG. 14, an input sensing unit 50 differs from itscounterpart of FIG. 9 in the location of the intersection between firstand second connecting wires 511 c and 521 c.

The intersection between the first and second connecting wires 511 c and521 c is not limited to being on the right side of a groove area GA. Thefirst and second connecting wires 511 c and 521 c may intersect eachother on the left side of a main hole area MH. In this case, a firstbridge wire 512 c may be disposed on the right side of the groove areaGA.

Referring to FIG. 15, an input sensing unit 50 differs from itscounterpart of FIG. 9 in that a first connecting wire 511 c bypasses acentral part of a main hole area MH from the outside of a secondconnecting wire 521 c.

The first and second connecting wires 511 c and 521 c both pass througha groove area GA when bypassing the main hole area MH, but the firstconnecting wire 511 c may bypass a central part of a hole AH from theoutside of the second connecting wire 521 c.

FIG. 16 is an enlarged plan view illustrating a part of an input sensingunit of an OLED display device according to another embodiment of theinvention. FIG. 17 is a cross-sectional view taken along line III1-III1′of FIG. 16. FIG. 18 is a cross-sectional view taken along lineIII2-III2′ of FIG. 16.

Referring to FIGS. 16 through 18, an input sensing unit 50 differs fromits counterparts of FIGS. 7, 9, and 10 in that first detectionelectrodes 510 are disposed in a first touch wire layer.

The first detection electrodes 510 may be disposed in the first touchwire layer. That is, first sensor members 511, first connecting members512, and a first connecting wire 511 c may be disposed in the firsttouch wire layer.

Second detection electrodes 520 may be disposed in a second touch wirelayer. That is, second sensor members 521, second connecting members(522 a and 522 b), and a second connecting wire 521 c may be disposed inthe second touch wire layer.

The first detection electrodes 510 and the second detection electrodes520 are disposed in different layers and a first touch insulating layer501 is interposed between the first detection electrodes 510 and thesecond detection electrodes 520, no additional bridge wires may beneeded for preventing a short circuit. Similarly, in a hole AH, noadditional bridge wires may be needed because the first and secondconnecting wires 511 c and 521 c intersect each other in a plan view butare insulated from each other.

FIG. 19 is an enlarged plan view illustrating a part of an input sensingunit of an OLED display device according to another embodiment of theinvention. FIG. 20 is a cross-sectional view taken along line IV1-IV1′of FIG. 19. FIG. 21 is a cross-sectional view taken along line IV2-IV2′of FIG. 19.

Referring to FIGS. 19 through 21, an input sensing unit 50 differs fromits counterparts of FIGS. 7, 9, and 10 in that second detectionelectrodes 520 are disposed in a first touch wire layer.

First detection electrodes 510 may be disposed in a second touch wirelayer. That is, first sensor members 511, first connecting members 512,and a first connecting wire 511 c may be disposed in the second touchwire layer.

The second detection electrodes 520 may be disposed in the first touchwire layer. That is, second sensor members 521, second connectingmembers (522 a and 522 b), and a second connecting wire 521 c may bedisposed in the first touch wire layer.

The first detection electrodes 510 and the second detection electrodes520 are disposed in different layers and a first touch insulating layer501 is interposed between the first detection electrodes 510 and thesecond detection electrodes 520, no additional bridge wires may beneeded for preventing a short circuit. Similarly, in a groove area GA,no additional bridge wires may be needed because the first and secondconnecting wires 511 c and 521 c intersect each other in a plan view butare insulated from each other.

FIG. 22 is an enlarged plan view illustrating a part of an input sensingunit of an OLED display device according to another embodiment of theinvention. FIG. 23 is a cross-sectional view taken along line V1-V1′ ofFIG. 22.

Referring to FIGS. 22 and 23, an input sensing unit 50 differs from itscounterpart of FIGS. 9 and 10 in that some first sensor members 511 andsome second sensor members 521 are disposed in a second non-display areaNDA2.

FIG. 22 illustrates that two first sensor members 511 are disposedadjacent to each other in a second direction dr2 with a hole AHinterposed therebetween. The first sensor members 511 may extend even toa peripheral area AHA of the second non-display area NDA2. Since a firstconnecting wire 511 c is disposed in a groove area GA, the first sensormembers 511 may also be disposed in the peripheral area AHA.

Similarly, FIG. 22 illustrates that two second sensor members 521 aredisposed adjacent to each other in a first direction dr1 with the holeAH interposed therebetween. Since a second connecting wire 521 c isdisposed in the groove area GA, the second sensor members 521 may alsobe disposed in the peripheral area AHA.

In the embodiment of FIGS. 22 and 23, since the areas of sensor members(511 and 521) that are disconnected by the second non-display area NDA2can be compensated for, touch sensitivity can be improved.

FIG. 24 is an enlarged plan view illustrating a part of an input sensingunit of an OLED display device according to another embodiment of theinvention. FIG. 25 is a cross-sectional view, taken along line V1-V1′ ofFIG. 22, of the input sensing unit of FIG. 24.

Referring to FIGS. 24 and 25, an input sensing unit 50 differs from itscounterpart of FIGS. 9 and 10 in that a second connecting wire 521 c isdisposed in a peripheral area AHA.

One of a first connecting wire 511 c and the second connecting wire 521c may be disposed to pass through a groove area GA, and the otherconnecting wire may be disposed not to pass through the groove area GA,but to pass through the peripheral area AHA. The connecting wiredisposed not to pass through the groove area GA, but to pass through theperipheral area AHA may be whichever of the first and second connectingwires 511 c and 521 c bypasses a main hole area MH from the outside ofthe other connecting wire.

For example, the second connecting wire 512 c may bypass the main holearea MH from the outside of the first connecting wire 511 c. In thiscase, the first connecting wire 511 c may be disposed to bypass acentral part of a hole AH from the groove area GA, and the secondconnecting wire 521 c may be disposed to bypass the main hole area MHfrom the peripheral area AHA. Also, in a case where the first and secondconnecting wires 511 c and 521 c intersect each other in the peripheralarea AHA, a first bridge wire 512 c may be disposed in the peripheralarea AHA.

FIG. 26 is a plan view illustrating the layout of an input sensing unitincluded in an OLED display device according to another embodiment ofthe invention. FIG. 27 is an enlarged plan view illustrating an area FF3of FIG. 26. FIG. 28 is a cross-sectional view taken along lineVII1-VII1′ of FIG. 27. FIG. 29 is a cross-sectional view taken alongline VII2-VII2′ of FIG. 27. FIG. 30 is a cross-sectional view takenalong line VII3-VII3′ of FIG. 27.

Referring to FIGS. 26 through 30, an input sensing unit 50 differs fromits counterpart of FIGS. 5, 9, and 10 in that it further includes firstelectrode patterns 591 and second electrode patterns 592.

The input sensing unit 50 may include the first electrode patterns 591in each first sensor member (511_2 a and 511_2 b) of each firstdetection electrode 510 and may include the second electrode patterns592 in each second sensor member 521_2 of each second detectionelectrode 520.

The first electrode patterns 591 may be disposed in each first detectionelectrode 510. The first electrode patterns 591 may be insulated fromeach first detection electrode 510. A plurality of first electrodepatterns 591 may be arranged in substantially the same direction as eachfirst sensor member (511_2 a and 511_2 b), i.e., in a second directiondr2. The first electrode patterns 591 may have a similar shape to eachfirst sensor member (511_2 a and 511_2 b), i.e., a rhombus shape, butthe inventive concepts are not limited thereto.

Pairs of adjacent first electrode patterns 591 may be connected by athird connecting wire 593. By designing the first electrode patterns 591and the third connecting wire 593 to not overlap with each first sensormember (511_2 a and 511_2 b), which is disposed in the same layer as thefirst electrode patterns 591 and the third connecting wire 593,electrical interference between the first electrode patterns 591/thethird connecting wire 593 and each first sensor member (511_2 a and511_2 b) can be prevented. As a result, the electrical reliability ofthe input sensing unit 50 can be improved.

The first electrode patterns 591 and the third connecting wire 593 mayextend across a first sensor member (511_2 a and 511_2 b) so that thefirst sensor member (511_2 a and 511_2 b) can be divided into first andsecond sub-sensor members 511_2 a and 511_2 b by the first electrodepatterns 591 and the third connecting wire 593. The first and secondsub-sensor members 511_2 a and 511_2 b may maintain their electricalconnection to each other via a third bridge wire 513 a.

The third bridge wire 513 a may intersect the third connecting wire 593.In one embodiment, the third bridge wire 513 a may be disposed in afirst touch conductive layer, and the third connecting wire 593 and thefirst electrode patterns 591 may be disposed in a second touchconductive layer. A first touch insulating layer 501 may be interposedbetween the third connecting wire 593 and the third bridge wire 513 a sothat the third connecting wire 593 and the third bridge wire 513 a canbe insulated from each other.

The first touch insulating layer 501 may include a plurality of fourthcontact holes CNT4, which expose parts of the third bridge wire 513 a.Each of the first and second sub-sensor members 511_2 a and 511_2 b mayinclude third connecting members 513. The third connecting members 513may be in contact with the third bridge wire 513 a via the fourthcontact holes CNT4, and the first and second sub-sensor members 511_2 aand 511_2 b may be electrically connected.

In one embodiment, the first electrode patterns 591 and the thirdconnecting wire 593 may form a noise detection electrode. The noisedetection electrode may change the reference potential of each firstdetection electrode 510 using an output signal (i.e., a noise signal)and may thus offset (or eliminate) common mode noise that may beintroduced into each first sensor member 511.

The first electrode patterns 591 may be connected to sixth signal lines580. The sixth signal lines 580 may extend from touch pad terminals in asecond pad area TPA2 along one side and/or the other side of a firstnon-sensing area NAA1 and may be disposed between fifth signal lines 570and a sensing area AA.

The sixth signal lines 580 may be noise detection wires. In oneembodiment, the sixth signal lines 580 may include first through eighthnoise detection wires 581 through 588. A voltage signal for detectingnoise may be applied to the sixth signal lines 580.

Two first electrode patterns 591 may be disposed adjacent to each othervia a hole AH interposed therebetween, and a third connecting wire 593connecting these two first electrode patterns 591 may be disposed tobypass a central part of the hole AH.

In one embodiment, the third connecting wire 593, a first connectingwire 511 c, and a second connecting wire 521 c may be sequentiallyarranged from a main hole area MH and may all be disposed to bypass themain hole area MH.

The third connecting wire 593 may intersect the second connecting wire521 c in a plan view. In order to prevent the third connecting wire 593and the second connecting wire 521 c from being short-circuited, afourth bridge wire 594 may be provided at the intersection between thethird connecting wire 593 and the second connecting wire 521 c so thatthe third connecting wire 593 can maintain its electrical connection tothe second connecting wire 521 c via the fourth bridge wire 594. In oneembodiment, the fourth bridge wire 594 may be disposed in the firsttouch conductive layer, and the second connecting wire 521 c may bedisposed in the second touch conductive layer. The first touchinsulating layer 501 may include a plurality of fifth contact holesCNT4, which expose parts of the fourth bridge wire 594. The thirdconnecting wire 593 may be in contact with the fourth bridge wire 594via the fifth contact holes CNT4 and can maintain its electricalconnection.

In one embodiment, the first, second, and third connecting wires 511 c,521 c, and 593 may be disposed to pass through a groove area GA. In thegroove area GA, the first, second, and third connecting wires 511 c, 521c, and 593 do not overlap with signal lines SGL. The signal lines SGLare disposed in a peripheral area AHA, but the first, second, and thirdconnecting wires 511 c, 521 c, and 593 are disposed to pass through thegroove area GA. Accordingly, signal interference between the signallines SGL and the first, second, and third connecting wires 511 c, 521c, and 593 can be reduced.

The second electrode patterns 592 may be disposed in each second sensormember 521_2. The second electrode patterns 592 may be insulated fromeach second sensor member 520. A plurality of second electrode patterns592 may be arranged in substantially the same direction as each secondsensor member 521_2, i.e., in a first direction dr1. The secondelectrode patterns 592 may have a similar shape to each second sensormember 521_2, i.e., a rhombus shape, but the inventive concepts are notlimited thereto.

The second electrode patterns 592 may be dummy patterns. The secondelectrode patterns 592 may be formed to make the area of each firstsensor member (511_2 a and 511_2 b), which is reduced due to theformation of the first electrode patterns 591, similar to the area ofeach second sensor member 521_2. The second electrode patterns 592 maybe island patterns, and thus, no connecting wires may be provided toconnect pairs of adjacent second electrode patterns 592. The secondelectrode patterns 592 may be formed in the same layer as the firstelectrode patterns 591, e.g., in the second touch conductive layer. Thatis, each first sensor member (511_2 a and 511_2 b), each second sensormember 521_2, the first electrode patterns 591, the second electrodepatterns 592, and the first, second, and third connecting wires 511 c,521 c, and 594 may all be disposed in the same layer, e.g., in thesecond touch conductive layer.

FIGS. 31 through 33 are cross-sectional views of an OLED display deviceaccording to another embodiment of the invention. FIGS. 31 through 33illustrate a modified example of the OLED display device of FIGS. 28through 30.

Referring to FIGS. 31 through 33, the OLED display device of FIGS. 31through 33 differs from the OLED display device of FIGS. 28 through 30in that first electrode patterns 591_1 and second electrode patterns 592are disposed in a first touch conductive layer.

The first electrode patterns 591_1 may be disposed in the first touchconductive layer. A third connecting wire 593_1 may also be disposed inthe first touch conductive layer.

The third connecting wire 593_1 may extend across a second connectingwire 521 c and a third connecting member 513 in a plan view. Since thethird connecting wire 593 may be disposed in the first touch conductivelayer and the second connecting wire 521 c and the third connectingmember 513 may be disposed in a second touch conductive layer, the thirdconnecting wire 593 can be insulated from the second connecting wire 521c and the third connecting member 513 without the aid of an additionalbridge wire.

FIGS. 34 and 35 are enlarged plan views illustrating parts of inputsensing units of OLED display devices according to other embodiments ofthe invention. FIGS. 34 and 35 illustrate modified examples of the inputsensing unit of FIG. 27.

Referring to FIGS. 34 and 35, the input sensing units of FIGS. 34 and 35differ from the input sensing unit of FIG. 27 in that at least one offirst and second connecting wires 511 c and 521 c is disposed only in aperipheral area AHA.

Some of first second, and third connecting wires 511 c, 521 c, and 593may not be disposed in a groove area GA. For example, as illustrated inFIG. 34, the second connecting wire 521 c may not be disposed in thegroove area GA and may be disposed to bypass a main hole area MH fromthe peripheral area AHA. In another example, as illustrated in FIG. 35,both the first and second connecting wires 511 c and 521 c may not bedisposed in the groove area GA and may bypass the main hole area MH fromthe peripheral area AHA.

Since some of the first, second, and third connecting wires 511 c, 521c, and 593 may be disposed in the groove area GA and signal lines SGLare disposed only in the peripheral area AHA, signal interference can bereduced.

FIG. 36 is a cross-sectional view of an OLED display device according toanother embodiment of the invention. FIG. 36 illustrates a modifiedexample of the OLED display device of FIG. 10.

Referring to FIG. 36, the OLED display device of FIG. 36 differs fromthe OLED display device of FIG. 10 in that a fourth capping layer 404extends to surround a sidewall of a light-emitting substrate 1000 thatis in contact with a hole AH.

The fourth capping layer 404 may be formed to extend even between theedge of a main hole area MH and the light-emitting substrate 1000. Thefourth capping layer 404 may planarize a sidewall of the hole AH. Thefourth capping layer 404 can prevent a hole overcoat layer 430 frompenetrating the main hole area MH.

FIG. 37 is an enlarged plan view illustrating the layout of an inputsensing unit of an OLED display device according to another embodimentof the invention. FIG. 37 illustrates a modified example of the inputsensing unit of FIG. 5.

Referring to FIG. 37, the input sensing unit of FIG. 37 differs from itscounterpart of FIG. 5 in the shape of detection electrodes (510_1 and520_1).

The shape of the detection electrodes (510_1 and 520_1) is not limitedto a mesh shape. The detection electrodes (510_1 and 520_1) may includetransparent electrodes. The transparent electrodes may include atransparent conductive oxide such as indium tin oxide, indium zincoxide, zinc oxide, or indium tin zinc oxide.

While the embodiments of the invention have been mainly described, theyare merely examples and are not intended to limit the invention, and itwill be understood by those of ordinary skill in the art that variousmodifications and applications which are not illustrated above can bemade without departing from the essential characteristics of theembodiments of the invention. For example, the respective componentswhich are specifically illustrated in the embodiments of the inventionmay be practiced with modifications. Further, the differences relatingto such modifications and applications should be construed as beingincluded in the scope of the invention as defined by the appendedclaims.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theappended claims and various obvious modifications and equivalentarrangements as would be apparent to a person of ordinary skill in theart.

What is claimed is:
 1. A display device comprising: a light-emittingsubstrate including a base substrate having a non-display area and adisplay area that surrounds the non-display area; an input sensing unitdisposed on the light-emitting substrate; and a hole penetrating frontand rear surfaces of the light-emitting substrate and front and rearsurfaces of the input sensing unit, wherein the light-emitting substrateincludes a plurality of recesses, the non-display area includes a holearea which overlaps with the hole, a recess area in which the pluralityof recesses are disposed and surrounds the hole area, and a peripheralarea which surrounds the recess area, and the input sensing unitincludes a plurality of first sensor members overlapping the displayarea and a first connector connecting the plurality of first sensormembers and overlapping the recess area.